Fonekong paste 138

FONEKONG Solder Paste  F11 ,  FONEKONG BGA Soldering Tin Cream Flux Paste 138℃  for electronic IC Phone motherboard soldering repair. FONEKONG  solder paste for PCB and small components welding.

Parameters:
Model: F11.
Melting Point: 138℃.
Alloy: Sn42Bi58,
weight: 50g.

Models:
F11: 138℃

Note: solder paste flux can only be sent out by special post mail.

Features:
1. 100% brand new and high quality
2. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
3. Good soldering and welding tool
4. Material: solder paste