Description
2UUL FX-002 Ultrasoft Jumper Wire 0.02mm 100m conductive flying line for mobile phone CPU solder joint peeling repair. 2UUL Ultrafine 0.02mm Jump Wire for mobile phone and electronic motherboard fingerprint and CPU BGA chip welding repair.
Option:
1. 2UUL FX-002A 0.02mm insulative insulated jump wire 100m.
Features:
1. No breakpoint, non-magnetic.
2. Good toughness.
3. Low solder resistance, easy to tin, no paint scraping.
4. Direct welding without breakpoint.
5. Suitable for mobile phone, iPad, tablet, and other electronic motherboard CPU BGA chips repair.



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