Description
Fonekong Solder Paste F10 Fonekong BGA Soldering Tin Cream Flux Paste 183℃ for electronic IC Phone motherboard soldering repair. Fonekong solder paste for PCB and small components welding.
Parameters:
Model: F10
Melting Point: 183℃
Alloy: Sn42Bi58,
weight: 50g.
Models:
F10: 183℃
Note: solder paste flux can only be sent out by special post mail.
Features:
1. 100% brand new and high quality
2. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
3. Good soldering and welding tool
4. Material: solder paste






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